摘要
以Cu粉和Cr2Nb粉为原材料,分别采用真空烧结和真空热压工艺制备新型Cu/Cr2Nb触头材料。研究了制备工艺、材料成分对Cu/Cr2Nb触头材料的组织和性能的影响规律。结果表明,采用一般烧结工艺难以制备出致密度高的Cu/Cr2Nb材料,而采用热压工艺不仅可制备出致密度高的Cu/Cr2Nb材料,而且与CuCr50触头材料相比,在硬度相当的前提下,Cu/Cr2Nb材料的导电性能显著提高。
The new- type Cu/Cr2Nb contact materials were fabricated from the mixture of Cu and Cr2Nb powders by the vacuum sintering and hot - pressing, respectively. The effects of fabrication processes and composition on the microstructures and properties were investigated. The results show that the Cu/Cr2Nb materials with high relative density are difficult to be obtained by the pressureless sintering, the Cu/Cr2Nb materials with high relative density can be fabricated by hot - pressing, compared with CuCr50 contact materials, the conductive behaviours of the hot - pressed Cu/Cr2Nb materials are greatly improved under the condition of the hardness of both materials being comparable.
出处
《粉末冶金技术》
EI
CAS
CSCD
北大核心
2007年第2期109-113,共5页
Powder Metallurgy Technology
基金
江西省自然科学基金项目(0350045)
江西省材料科学与工程研究中心基金项目(ZX200301002)
航空科学基金项目(05G56003)
江西省教育厅科技项目(项目名称:新型CuNbCr2真空断路器触头材料及其应用研究)
关键词
Cu/Cr2Nb触头材料
烧结和热压
组织与性能
Cu/Cr2Nb contact materials
aintering and hot- pressing
microstructures and properties
