摘要
通过不同升温速率下DSC研究了E51环氧树脂与DIA芳香胺固化体系的固化工艺、固化交联反应动力学参数及树脂体系的耐热性,利用FTIR方法计算了体系的固化度。通过分析确定了树脂的固化工艺,采用Kissinger、Ozawa法计算出树脂表观活化能,其均值为87.02kJ/mol,结合Crane公式求出反应级数为0.93。采用扭辫法测得玻璃化转变温度Tg=178℃。热失重曲线表明,体系的起始分解温度为364℃。
Curing process, curing cross-linking reaction kinetics parameters and thermal resistance of DIA/epoxy resin system were investigated by DSC under different heating-up rates, and curing degree of the system was calculated by means of FTIR method. The curing process of the resin system was determined. Apparent activation energy of the resin was calculated by using Kissinger and Ozawa methods and its average value is equal to 87.02 kJ/mol. Based on Crane formula, the calculated reaction series is 0.93. Glass transition temperature（Tg） measured by torsional braid analysis（TBA） is up to 178℃. The TG curves show that the initial decomposition temperature of the system is 364℃.
出处
《固体火箭技术》
EI
CAS
CSCD
北大核心
2007年第2期163-165,176,共4页
Journal of Solid Rocket Technology
基金
黑龙江杰出青年基金资助(JC04-12)
关键词
环氧树脂
反应动力学
玻璃化转变温度
epoxy resin
reaction kinetics
glass transition temperature
