摘要
基于能量最小原理，采用三维有限元方法，考察了片式元件与基板的间隙对ＳＭＴ焊点三维形态的影响，利用焊点系统的能量数据，分析元件与基板的间隙。研究表明，元件与基板的间隙对焊点三维形态有重要影响，元件与基板的间隙随焊点钎料量的增加和焊盘伸出长度的减小而增加，提出了间隙与钎料量。
By employing the minimum energy theorem,the effects of stand-off height(SOH)between chip component and substrate on three-dimensional(3-D)solder joint geometry were investigated with 3-D finite element method The stand-off height was analyzed with the use of potential energy data of the solder joint system The results show that SOH has important effects on solder joint geometry,the SOH increases with the increase of solder volume and the decrease of pad extension length Moreover,a regression model for the relationship between SOH,solder volume and pad extension length was put forward
出处
《电子工艺技术》
1997年第2期60-62,共3页
Electronics Process Technology
基金
国家高等学校博士学科点基金
