摘要
采用微胶接技术装配微型步进电机的基体和导轨。对胶粘剂的点胶特性进行实验,指出微电机胶接装配中影响胶接质量的两个关键因素是胶滴体积的不稳定和胶滴的扩散。为了解决该问题,在基体胶接区表面通过蚀刻方法加工出凹槽结构,给出凹槽尺寸的确定原则和胶接实验的条件。结果表明,凹槽结构对胶滴体积具有“容错性”,可以在一定程度上克服胶滴体积的不稳定和胶滴的扩散对微胶接装配质量的影响,但胶滴点胶的位置误差可能引起胶滴溢出凹槽。
The adhesive bonding technology had been applied in the assembly of a micro step motor. The adhesive, dispensing equipment and the assembly platform were introduced. The major problems in micro adhesive bonding were analyzed, which were the fluctuation of the droplet＇s volumes and its spreading. A method taking advantage of the surface structure on the bonding area was tested. The basic principles to define its geometry and different parameters for experiments were given. The results show that, the basic groove structure has the ability of ＂fault-tolerance＂ to the volume of droplet, and thus can overcome the influence of the mentioned factors on the quality of micro adhesive bonding. But the position error of the adhesive droplet can result in its spreading out of the groove.
出处
《中国机械工程》
EI
CAS
CSCD
北大核心
2007年第9期1024-1027,共4页
China Mechanical Engineering
基金
德国科学基金会资助项目(SFB516)
德国下萨克森州政府奖学金资助项目
关键词
微电机
微装配
微胶接
表面结构
micro motor
micro assembly
micro adhesive bonding
surface structure
