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聚酰胺1010/Ag复合薄膜的制备与微结构 被引量：1

Studies on the preparation and micro structure of metallized(Ag) films of polyamide1010
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摘要 用原位化学还原法制得了聚酰胺1010表面金属(Ag)化薄膜材料,用X-射线衍射仪和傅里叶变换红外光谱仪对复合薄膜的非键合相互作用与表面结构进行了研究.金属银以纳米晶粒分散于聚合物基体中,该薄膜可用于反射和导电材料. Metallized （Ag） films of Ag/Polyamidel010 were obtained with in-situ chemical reductin. The nonbonded interaction and surficial structure of composite film were studied by means of FTIR and XRD. Sliver exists as nano-scale particles on the surface of polyamide, and therefore silver layer is bonded strongly on the polyamide matrix without peeling off. The film can be used as reflective and conductive materials.
作者 程晓敏 丁利 李万里 张小明
机构地区 安徽大学化学化工学院
出处 《应用科技》 CAS 2007年第5期61-64,共4页 Applied Science and Technology
基金 安徽省教育厅自然科学基金资助项目(2005kj144)
关键词 聚酰胺1010 还原 表面金属化 导电性 polyamidel010 reduction suface-metallization conductivity
分类号 TB331 [一般工业技术—材料科学与工程]
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参考文献7

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共引文献25

同被引文献14

  • 1肖旭贤,黄可龙,肖静怡,何琼琼.载银纳米磁粒抗菌剂的研究[J].功能材料,2006,37(12):1870-1872. 被引量：1
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应用科技
2007年 第5期

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