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含羟基马来酰亚胺固化邻甲酚醛环氧树脂 被引量:8

Curing Reaction of o-Cresol Formaldehyde Epoxy Resin with Maleimide Containing Hydroxyl Group as Cure Agent
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摘要 合成N-对羟基苯基马来酰亚胺,并将其用作固化剂固化邻甲酚醛环氧树脂.采用DSC方法研究了HPM固化邻甲酚醛环氧树脂反应的固化反应动力学.对固化产物的热分析结果表明:N-对羟基苯基马来酰亚胺是非常良好的耐热固化剂,可明显提高邻甲酚醛环氧树脂的耐热性能,固化产物的起始热分解温度为338℃,分解10%时的温度为386℃,700℃时的残留百分量为49%. N-p-hydroxyphenylmaleimide (HPM) was synthesized, and the curing reaction of o-cresol formaldehyde epoxy resin with N-p-hydroxyphenylmaleimide as the cure agent was investigated. The kinetics of the curving reaction was also investigated by DSC using Kissinger method. The thermal properties of the cured resin were determined. The initial degradation temperature was 338 ℃, the temperature at which weight loss is 10% was 386℃, and the char yield at 700 ℃ was 49%. The results showed that N-p-hydroxyphenylmaleimide was an excellent cure agent for o-cresol formaldehyde epoxy resin, which could improve the thermal properties of the cured resin.
出处 《湖南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2007年第5期71-73,共3页 Journal of Hunan University:Natural Sciences
关键词 马来酰亚胺 邻甲酚醛环氧树脂 固化反应 热性能 maleimide o-cresol-formaldehyde epoxy resin curing reaction thermal properties
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