摘要
研究了一种适合铝丝键合后热老化要求的金导体浆料,性能达到使用要求。在金浆中添加了少量合金元素,并选用混合型粘结剂。对金导体铝丝焊后热老化失效机理以及添加合金元素的作用。
A gold conductor paste fitting thermoageing requirement after aluminium wire bonding has been researched, Properties of this paste meets usable requirement. A trace of alloy has been added to the paste and mixed bonding is selected. The thermoageing failure mechanism after aluminium wire bonding of this gold conductor and function of added alloy are discussed.
出处
《电子元件与材料》
CAS
CSCD
1997年第2期13-16,共4页
Electronic Components And Materials
关键词
金导体浆料
铝丝键合
热老化
空隙
gold conductor paste, aluminium wire bonding, thermoageing, Kirkendall gap