摘要
以标码机下支架为例,应用MoldFlow软件分析了浇口位置、熔体温度、模具温度和保压压力对熔接痕和翘曲变形的影响,分析熔接痕和翘曲变形产生的原因,通过优化设计方案,消除了产品正面及背面的熔接痕,减小了翘曲变形,分析结果与生产实际吻合。
Taking the subframe of label machine as an example, the effects of gate location, the melt temperatures and mold temperature, hold pressure on weld line and warpage were analyzed by using MoldFIow software; meanwhile, the causes for weld line and warpage were analyzed. By use of optimum design scheme, weld lines on the front and back surfaces of product were eliminated and warpage was improved, which are in agreement with the practical results.
出处
《塑料科技》
CAS
北大核心
2007年第6期76-79,共4页
Plastics Science and Technology
