摘要
利用直流磁过滤多弧离子镀技术在铝基复合材料基片上镀制大于25μm的TiN厚膜.对厚膜TiN的附着力及其与各种工艺条件的关系.采用扫描电镜对厚膜TiN的微观结构及划痕形貌进行了分析.研究结果表明:基片的清洗、基片的温度、孤电流、脉冲偏压和镀层界面组织结构等都影响厚膜TiN的附着力;弧电流为70A、脉冲偏压为100V、占空比为70%、温度为200℃时,厚膜TiN的临界载荷达到4.5kg/mm^2,远大于指标要求4kg/mm^2;镀层界面的融合有利于提高厚膜TiN的附着力.
The thick-film TiN of more than 25μm has been deposited on the Aluminum matrix composites using the pulse bias assisted direct current filtered cathodic vacuum arc（FCVA） deposition technology. The relation between the adhesive strength of thick-film and process condition has been analyzed. The microstructures and scratch morphology of thick-film TiN are analyzed by the scanning electron microscop. The results show：Methods of cleaning substrate, substrate temperature,arc current, pulsed biasoand microstructure of interface effect adhesive strength of thick-film TiN; The critical load of thick-film TiN is 4. 5 kg/mm^2 ,which is higher than standard request 4 kg/mm^2 ,when the arc current is 70 A,the pulsed bias is 100 V, the duty cycles is 70% and the substrate temperature is 200℃; The interface fusion is in （avor of increasing adhesive strength of thick-film TiN.
出处
《西安工业大学学报》
CAS
2007年第2期110-113,共4页
Journal of Xi’an Technological University
基金
国防科工委基金项目(74)
关键词
厚膜TiN
附着力
脉冲偏压
弧电流
thick-film TiN
adhesive strength
pulsed bias
arc current
