摘要
利用傅立叶红外原位在线技术研究了硼酚醛树脂在固化过程中的结构变化情况。研究表明，在升温固化过程中，羟基指数下降，硼氧键指数、酚羟基指数、羰基指数先升高后下降；确定了硼酚醛树脂的固化温度为180℃，固化时间为12～38min。
The configuration change in curing process of boron-modified phenolic resin was investigated by using online Fouirier transform infrared spectroscopy（ FTIR）. During the curing process from room temperature to 270℃, hydroxy index decreased, B-O bond index, phenolic hydroxy, carbonyl index increased first and then decreased. The optimum curing temperature was 180℃, and the optimum curing time was 12 -38 minutes.
出处
《工程塑料应用》
CAS
CSCD
北大核心
2007年第7期51-54,共4页
Engineering Plastics Application
关键词
硼酚醛树脂
傅立叶变换红外光谱
固化
表征
boron-modified phenolic resin, fouirier transform infrare, curing, characterization
