期刊文献+

快速冷却和扩散退火对Sn-Bi-X焊料的影响 被引量:7

Influence of rapid cooling and diffusion annealing on Sn-Bi-X solder
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摘要 通过对自行研制的Sn-Bi-X(X=Ag,Cu,Ge,Ce,Sb)无铅焊料进行快速冷却及扩散退火处理,研究其显微观组织和性能的变化。结果表明,冷却速度越大,熔点越低,共晶比例越小。当甩带速度为1 000 r/min时,熔点由190.5℃降低至186.2℃,且Sn-58Bi共晶相完全消失。扩散退火能消除Bi的粗化晶体,使组织均匀,增强焊料的力学性能,并且退火后组织稳定。扩散退火可以作为表面贴装生产工艺流程的一个工序,退火工艺以125℃保温16 h为宜。 A self-fabricated Sn-Bi-X(X=Ag, Cu, Ge, Ce, Sb) lead-free solder was treated by rapid cooling and diffusion annealing, the changes of its microstructures and properties were investigated. The results show that, the faster the cooling rate, the lower the melting point and the smaller the percent of eutectic is. When the melt spinning rate is up to 1 000 r/min, the melting point decreases from 190.5 ℃ to 186.2 ℃, and the eutectic phase of Sn-58Bi disappears fully. Diffusion annealing can remove the coarse crystal of Bi, uniform the microstructure and enhance the mechanical property of Sn-Bi lead-free solder. The microstructure is stable after annealing. Diffusion annealing can be a procedure of surface mounting production process. Annealing at 125 ℃ for 16 h was approved well.
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2007年第8期1319-1323,共5页 The Chinese Journal of Nonferrous Metals
关键词 Sn-Bi系无铅焊料 偏析 快速冷却 扩散退火 Sn-Bi lead-free solders segregation rapid cooling diffusion anneal
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参考文献14

  • 1Wood E P,Nimmo K L.In search of new lead-free electronic solders[J].J Electron Mater 1994,23(8):709-713.
  • 2Zeng K,Tu K N.Six cases of reliability study of Pb-free solder joints in electronic packaging technology[J].Materials Science and Engineering,2002,38(1):55-105.
  • 3Tu K N,Gusak A M,Li M.Physics and materials challenges for lead free solders[J].Journal of Applied Physics,2003,93(3):1335-1338.
  • 4Xia Z D,Chen Z G,Shi Y W,et al.Effect of rare earth element addition on the microstructure and mechanical properties of tin-sliver-bismuth solder[J].J Electron Mater,2002,31(6):564-567.
  • 5Suganuma K.Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J].Scripta Materialia,1998,138(9):1333-1340.
  • 6Suganuma K.无铅焊接技术[M].北京:科学出版社,2004:51-144.
  • 7LI Yuan-shan,LEI Xiao-juan,CHEN Zhen-hua.A novel low melting point Pb-free solder[J].Circuits Assembly,2007,18(2):54-57.
  • 8Suganuma K.Lift-off phenomenon in wave soldering[J].Acta Materialia,2000(48):4475-4481.
  • 9何鹏,赵智力,钱乙余.Sn-Bi-Ag-Cu钎料波峰焊焊点的剥离现象[J].中国有色金属学报,2005,15(7):993-999. 被引量:10
  • 10Vincent J H,Humpston G..Lead-free solders for electronic assembly[J].GEC Journal of Research,1994,11(2):76-89.

二级参考文献49

  • 1贾兰坡,尤玉桂.山西怀仁鹅毛口石器制造场遗址[J].考古学报,1973(2):13-26. 被引量:38
  • 2Nakatsuka T.Reliability of Pb-free solder joints of surface-mounted LSI packages after flow-solder[J].IMAPS,2000,9:330-335.
  • 3Handwerker C.NIST Research in Lead Lead-Free Solders:Properties,Processing,Reliability[R].National Institute of Standards and Technology (NIST),2002.
  • 4Suganuma K.Influence of various factors on lift-off phenomenon in wave soldering with Sn-Bi alloy[J].Jpn Inst Electron Package,1999,2:116-20.
  • 5Suganuma K.Advances in lead-free electronics soldering[J].Current Opinion in Solid State and Materials Science,2001,5:55-64.
  • 6Suganuma K.Mechanism and prevention of lift-off in lead-free soldering[A].Proc 33rd International Symposium on Microelectronics[C].Boston:Massa-chusetts,2000.303-307.
  • 7Lead-Free Solder Project Final Report[R].Germany:UNCMS,Report0401RE96.1997.
  • 8Suganuma K.Microstructural features of lift-off phenomenon in through-hole circuit soldered by Sn-Bi alloy[J].Scripta Materialia,1998,l38(9):1333-1340.
  • 9Suganuma K.Lift-off phenomenon in wave soldering[J].Acta Materialia,2000,48:4475-81.
  • 10Ishizuka K,Kawano T.Tests of fillet lifting phenomena in lead-free solder[A].6th Microjoining and Assembly Technology in Electronics[C].USA:6th MATE Organise,2000.297-302.

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