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半导体的脉冲激光微细加工的皮秒动力学特性 被引量:1

Picosecond Dynamics of Pulse Laser Microprocessing of Semiconductor
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摘要 讨论了皮秒脉冲激光微细加工时半导体中电子-空穴等离子体的作用及动力学特性。指出高密度电子-空穴等离子体使半导体的介电和光特性发生了显著变化。通过测量材料表面反射比的实验表明,它与热熔化模型比较符合,等离子体将能量瞬时转换给晶格,加热晶格到熔点,从而进行微细加工。 The dynamics of the electron-hole plasma and its role in picosecond laser microprocessing of the semiconductor are discussed. It is presented that because of the presence of a high density electronhole plasma, the dielectric and optical properties of the semiconductor should undergo an appreciable change. We have measured simultaneous time-resolved reflectivity of material surface. Experimental results agree with the thermal melting model,which expresses the fact that,the plasma transfers the energy to the lattice instantaneously and,therefore,heats the lattice to the melting point,followed by a microprocessing.
作者 徐国昌
出处 《真空科学与技术》 CSCD 北大核心 1997年第2期110-113,共4页 Vacuum Science and Technology
关键词 脉冲激光 微细加工 皮秒动力学 半导体 Pulse laser, Microprocessing, Picosecond dynamics, Electron-hole plasma
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