摘要
目的:探讨在涉及龈下的牙体龋损及楔状缺损充填修复时应用排龈线可否预防悬突的形成。方法:选择牙周组织健康的门诊患者24人口腔中齐龈或涉及龈下≤1mm的唇颊侧牙颈部龋缺损共80颗牙,随机分配样本为两组,试验组应用排龈线对窝洞处的牙龈进行排龈后用复合树脂充填。对照组常规窝洞预备后直接用复合树脂充填。充填1个月检查悬突的发生情况;收集两组充填前、充填1、3及6个月测试位点的龈沟液(GCF)量、检测GCF中天门冬氨酸转氨酶(AST)水平。测量菌斑指数(PLI)、龈沟出血指数(SBI)、牙周探诊深度PD)进行统计学分析。结果:充填1个月试验组修复后悬突的发生率低于对照组,差异有显著性(P<0.01)。充填后6个月试验组与对照组的PLI、SBI、PD、GCF无统计学差异(P>0.05),试验组GCF-AST水平明显低于对照组,差异有显著性(P<0.01)。结论:排龈线对齐龈或龈下边缘的充填悬突形成的预防效果好。建议临床中充填上述龋缺损时将使用排龈线作为一项常规措施。
Objective：The aim of our research is to observe whether gingival retraction cord can prevent overhanging in fillings of subgingival cavities and odonto-defects.Methods：80 teeth with dental caries or defects in 24 patients were selected.The teeth were divided into 2 groups randomly.In group 1,dental caries were removed and cavities were prepared routinely,and filled with composite resin after using retraction cord to retract gingival.The dental fillings were shaped and polished.The other is control group,caries were removed and filled directly.Gingival crevicular fluid（GCF）quantity and AST levels,plaque index（PLI）,sulcus bleeding index（SBI）and periodontal probing depth（PD）were measured on 1 month,3 months and 6 months after operation.Results：1 month after operation,the incidence of ODRs in group using retraction cord to retract gingiva was significantly lower than that of the control group（P〈0.01）.6 months after operation,no significant difference found between GCF levels,the frequencies of PLI≥2 and SBI≥2 and periodontal probing depth in the EG and CG（P〉0.05）,but the AST levels between the EG and CG were significantly different（P〈0.01）.Conclusion：It was possible to use retraction cord to prevent overhanging in filling cervical cavities defects with leveling at or 1mm below gingival margin,and then to prevent the damage of periodontal tissue in clinical experiments.
出处
《口腔医学研究》
CAS
CSCD
2007年第5期533-536,共4页
Journal of Oral Science Research
基金
福建省卫生厅青年科研基金资助项目(编号:2002-1-12)
关键词
排龈线
牙体修复悬突
龈沟液
天门冬氨酸转氨酶
Gingival retraction cord Overhanging Gingival crevicular fluid Aspartate aminotransferase
