期刊文献+

热超声键合换能系统阻抗/导纳模型 被引量:7

IMPEDANCE/ADMITTANCE MODEL OF ULTRASONIC TRANSDUCER SYSTEM IN THERMOSONIC BONDING
下载PDF
导出
摘要 采用等效电路方法建立换能系统的阻抗/导纳集总参数模型,包含各子部分的材料特性、尺寸、系统损耗因子、谐振频率、激励电信号以及不同负载下系统阻抗和导纳等动力学特性。以无键合工具与有键合工具两种不同负载为例计算得到,在100kHz范围内系统包含4阶轴向谐振频率:相比于无键合工具条件,有链合工具负载条件下的各阶谐振频率增大,其电阻值增大,电导值降低。阻抗分析仪试验与有限元分析结果均验证系统阻抗/导纳模型的正确性。 An impedance and admittance model of transducer system, which includes system features such as material, size, loss factor, resonance frequency, exciting electrical signal and different loads, is established by equivalent circuit method. For two different loads with/without bonding tool, the impedance and admittance of transducer system are calculated based on above model. The numerical computations show that, there are four axial vibration modes of transducer system in 100 kHz. Comparing to no-tool condition, each resonance frequency and its impedance increase when with bonding tool. The result of sweeping measurement by impedance analyzer and FEM model are used to verify the impedance/admittance model.
出处 《机械工程学报》 EI CAS CSCD 北大核心 2007年第10期14-19,共6页 Journal of Mechanical Engineering
基金 国家自然科学基金(50390064 50605064) 国家重点基础研究发展计划(973计划 2003CB716202) 教育部博士点基金(20060533068) 长江学者创新团队发展计划(IRT0549)资助项目。
关键词 阻抗/导纳 等效电路模型 换能系统 热超声键合 Impedance/admittance Equivalent circuit model Ultrasonic transducer Thermosonic bonding
  • 相关文献

参考文献11

  • 1RAO R T. Microelectronics packaging handbook[M]. New York: McGraw-Hill Publisher, 2001.
  • 2KANG S Y, WILLIAMS P M, LEE Y C. Modeling and experiment studies on thermosonic flip chip bonding[J].IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 1995, 18(4): 728-733.
  • 3OR S W, CHAN H L W, LO V C, et al. Dynamics of an ultrasonic transducer used for wire bonding[J]. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 1998, 45(6): 1 453-1 460.
  • 4梁召峰,林书玉.余弦形过渡段阶梯形变幅杆研究[J].陕西师范大学学报(自然科学版),2003,31(4):32-35. 被引量:15
  • 5PARRINI L. Advanced process characterization for 125 kHz wire bonder ultrasonic transducers[J]. IEEE Transactions on Ultrasonic, Ferroelectrics and Frequency Control, 2001,48(6): 1 632-1 639.
  • 6AHMED M H, YOUSSEL H A. Computer-aided design of acoustic horns for ultrasonic machining using finite-element analysis[J]. Journal of Materials Processing Technology, 1995, 55: 254-260.
  • 7STEWART S, BENJAMIN P, YOSEPH B C. Modeling of horns for sonic/ultrasonic applications[C]//IEEE Ultrasonics Symposium, Lake Tahoe, Canada, 1999: 621-626.
  • 8BAO Xiaoqi, YOSEPH B C, CHANG Z. Modeling and computer simulation of ultrasonic/sonic driller/corer[J]. IEEE Transactions of Ultrasonics, Sonics and Frequency Control, 2003, 50(9): 1 147-1 160.
  • 9赵福令,冯冬菊,郭东明,方亚英.超声变幅杆的四端网络法设计[J].声学学报,2002,27(6):554-558. 被引量:64
  • 10顾煜炯,周兆英,姚健.超声振动系统的四端网络设计方法及其应用[J].机械工程学报,1997,33(3):94-101. 被引量:27

二级参考文献7

共引文献108

同被引文献57

引证文献7

二级引证文献10

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部