摘要
由于MSA体系在环保、镀液稳定方面的优势,近10年来在印制板电镀与精饰、电子元件、线材和带材镀锡铅合金等电化学领域得到了广泛的应用,已逐步替代了传统的氟硼酸镀液。文章介绍了甲基磺酸盐镀液体系在锡及可焊性锡合金镀层中的一些应用与特点。
Pollution is gready lightenol anel bath stability Methane sulphonic acid （ MSA ） bath system has largely replaced fluoroboric acid in the fields of electroplating and delicacy decorating of printed board, electronic component, wire and strip materials plated by tin and lead alloy during the past ten years due to its advantages in pollution control and bath stability. This paper reviews the current applications and characteristics of methyl-sulfonate bath system in plating of solderable tin and tin based alloy.
出处
《云南冶金》
2007年第5期46-49,共4页
Yunnan Metallurgy
关键词
甲基磺酸盐
电镀
化学镀
锡基合金
可焊性镀层
methyl-sulfonate
electroplating
chemical plating
tin based alloy
solderable tin coating
application
