摘要
贴片工艺是用粘接剂将芯片贴装到金属引线框架(一般是由铜制成)上的过程。富铅的Pb/Sn/Ag软焊料在功率器件封装贴片工艺中作为粘接剂应用十分广泛。从功率器件整体来看,贴片焊层毫无疑问是影响器件可靠性最重要的因素之一,其不仅具有良好的导电导热性能,而且该焊层能够吸收由于芯片和引线框架之间的热失配而产生的应力应变,保护芯片免于受到机械应力的损伤。基于Darveaux的热疲劳寿命分析模型,利用功率循环加速实验以及有限元方法具体分析了贴片焊层厚度BLT对于功率器件热可靠性的影响。并通过实验与仿真的结果,提出提高功率器件热可靠性的设计原则。
Die attach process is to put the dies onto the metal substrates with conductive adhesives. The soft solder of Pb/Sn/Ag is widely used as the adhesive material in the power device package and die attach process. So from this point of view, the solder layer plays the most important role in the reliability of the deivce. The good adhesive lays act as the electrical and thermal connections and the buffer layers for coefficient of thermal expansion mismatch between dies and substrates. Based on the Darveaux＇ s life prediction model, the power cycle experiments and finite element methods were utilized to analyze the impact of the BLT （bonding line thickness） on the thermal reliability of the power deivces. The design rule was proposed to improve the thermal reliability of the power deivces with the experiments and simulation results.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第11期933-936,共4页
Semiconductor Technology
关键词
功率器件
贴片焊层厚度
功率循环
有限元分析
power device
bonding line thickness （BLT）
power cycling
finite element analysis
