摘要
采用Al2O3-硅酸盐玻璃复合体系制备低温烧结玻璃陶瓷，通过TG-DTA、XRD、SEM等分析方法对样品进行表征，随着玻璃含量的增加玻璃陶瓷的烧结温度逐渐降低，在玻璃含量约为50％（质量分数）时玻璃陶瓷的热导率达到最大值2．70W/m·K，此时的玻璃陶瓷具有低的烧结温度（800℃）、高的相对密度（≥95％）、低的电容率（8～10）、低的介电损耗（1．5％～0．7％），有望成为LED封装用基板材料。
Al2O3-silicate glass-ceramics were prepared by the low temperature co-firing technique. The thermal properties of the samples were analyzed with DTA and TG. The chemical structures of the glass-ceramics were identified with XRD, and the microstructure of them were observed with SEM. With the increasing of glass content, the sintering temperature descreased. The thermal conductivity of the sample reached a maximal value of 2.70W/m.K at approximately 50 wt% of glass content, in addition to high relative density （≥95%）, low-temperature sintering behavior （800℃）, low dielectric constant （8-10）, and low dielectric loss （1.5%-0.7%）, indicating applicable as LED encapsulation materials.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2007年第A02期842-845,共4页
Journal of Functional Materials
关键词
低温共烧
玻璃陶瓷
热导率
low temperature co-fired
glass ceramic
thermal conductivity
