摘要
利用原子力显微镜(Atomic Force Microscopy,AFM)研究硫酸盐还原菌(Sulfate Reducing Bacteria,SRB)、微生物膜和腐蚀前后铜合金材料BFe30-1-1的表面形貌,得到了高分辨率的表面形貌图,测得SRB的大小、点蚀坑的深度和直径,分析了腐蚀后BFe30-1-1的表面粗糙度参数。结合电化学参数说明,浸蚀14d的铜合金表面形成了不均匀的微生物膜,加速了试片表面的局部腐蚀。AFM作为一种具有纳米级分辨成像能力的工具,是观察材料的表面特征和腐蚀形貌及测量材料表面纳米粗糙度的理想仪器。
Atomic force microscopy （AFM） was applied to obtain high-resolution topographical images of sulfate-reducing bacteria, and to observe the biofilms developed on the BFe30-1-1 copper alloy. The use of AFM image analysis software allowed estimation of the width and height of bacterial cells, and the characterization of the surface roughness of the copper alloy, including measurements of depth and diameter of individual pits. Following the removal of biofilms, the copper alloy surfaces were profiled using AFM to determine the degree of copper alloy deterioration.
出处
《表面技术》
EI
CAS
CSCD
2007年第6期30-32,35,共4页
Surface Technology
关键词
原子力显微镜
硫酸盐还原菌
微生物膜
腐蚀
Atomic force microscopy
Sulfate-reducing bacteria
Biofilm
Corrosion
