摘要
阐述了塑封GaAs MMIC的主要失效模式和失效机理,根据40余例实际案例,得出了其使用中的失效机理分布,并给出几例典型的失效分析案例。
The main failure modes and failure mechanisms of plastic encapsulated GaAs MMICs are described in this paper. Based on about 40 practical cases, the distribution of the failure mechanisms in use is obtained. Finally, several typical failure analysis cases are introduced.
出处
《电子产品可靠性与环境试验》
2007年第6期8-10,共3页
Electronic Product Reliability and Environmental Testing
