摘要
键合头为粘片机上的关键部件,需要精确、平稳地往返于拾片和粘片位置,实现芯片的拾取、传送和粘接等动作。分析了粘片机用键合头机构的作用及性能要求,介绍了曲柄摇杆机构在粘片机键合头设计上的应用。
Bond head is the critical assembly in the die bonder, which shuttles from pick position to bond position accurately and smoothly and accomplishes the action of picking die, carrying die and bonding die. This article analyzes the functions and technical specifications of bond head, and presents the mechanical structures of the bond head in the die bonder by means of crank and rocker mechanism.
出处
《电子工业专用设备》
2007年第12期40-42,48,共4页
Equipment for Electronic Products Manufacturing
关键词
键合头
粘片机
拾片
粘片
曲柄摇杆机构
Bond head
Die bonder
Pick
bond
Crank and rocker mechanism
