摘要
运用ANSYS软件建立了三维轴对称有限元模型,对金刚石厚膜(ф40mm×1mm)内部和膜/钼基体界面处的热残余应力各个分量的分布作了全面的模拟,讨论了热残余应力对金刚石厚膜失效的影响。结果表明,金刚石厚膜内的热残余应力各个分量并非均匀分布,离界面越近,其值越大;界面处大的轴向拉应力和剪应力对于厚膜从基体上脱落有重要影响;在膜的上表面靠近外边缘局部区域内存在较大的径向拉应力和轴向拉应力,是造成膜开裂失效的原因;本文的三维有限元模型比以往的一维解析模型更全面,且能更合理地解释金刚石膜的失效现象。
A three-dimension （3-D） axial-symmetric finite element model was established by using ANSYS software. Based on this model, the distributions of thermal residual stress components in diamond thick films （φ40mm×1 mm） and at interface between the films and Mo substrate were simulated comprehensively, and the influence of thermal residual stresses upon the films＇ failure was analyzed. The results show that;①the distribution of each thermal residual stress component is not uniform, and the nearer the location apart from the interface is, the larger the magnitude of each component is. ②The large shear stress and tensile axial stress at the interface have an important effect on the films detaching from substrate.③There are large tensile radial stresses and tensile axial stresses in the vicinity of upper surface of the films, which is the reason for the crack of the films. ④The 3-D model in this paper is more overall than the known 1-D analytical model,and it can explain the phenomenon of the films＇ failure more reasonably.
出处
《激光与红外》
CAS
CSCD
北大核心
2008年第1期81-83,共3页
Laser & Infrared
基金
总装备部总装预研基金
西南交通大学科学研究基金
四川省应用基础研究项目
关键词
金刚石厚膜
热残余应力
模拟
失效
thick diamond films
thermal residual stresses
simulation
failure
