摘要
单晶硅材料以其优异的物理性能成为了新型轻质反射镜材料,而且设计人员要求在硅晶体端面形成大量异形盲孔。但是,采用传统加工方法很难保证其完整性、加工效率和质量。针对设计、生产的实际情况,研究了超声加工机理,提出了基于Hopfield网络的硅镜超声加工路径规划方案,并给出了规划路径。研究结果表明,该方案为生产实践提供了理论依据,具有广阔的推广应用前景。
Single crystal silicon material has outstanding physical performance and has become new type light reflector material. Designers desire to mechanize abnormal blind holes on the end surface of silicon crystal. However, it is hard to assure the integrality of the silicon crystal as well as the machining efficiency by using traditional machining method, and the quality is poor. According to the practical situation, the ultrasonic machining mechanism was studied, planning method for ultrasonic machining path of silicon-reflector based on Hopfield network was presented, and planning path was given. The research results show that the plan provides the theoretical basis for the performance of the project, and it illustrates a good prospect of application and extension.
出处
《机电工程》
CAS
2008年第2期15-17,共3页
Journal of Mechanical & Electrical Engineering
基金
浙江省自然科学重点基金资助项目(Z105528)
