摘要
基于微通道板的清洗工艺,设计了清洗设备的结构,并对设备的核心部件详细说明。利用液体射流喷射实现喷淋清洗,采用液体液下喷射循环实现液体的紊流,减少了搅动和传动系统为系统带来的复杂性。利用超声和兆声双频率清洗实现了对MCP不同粒径腐蚀产物和污染物的清洗,工作槽斜底式设计和频率扫描改进槽内声场的均匀性,功率精度达到±10%。储液槽预热结合在线加热,使液体温度精度达±0.5℃,改善了MCP清洗主要工艺参数的稳定性和一致性,体现了湿法清洗的独创性和实用性,实现了清洗工艺过程的半自动化。
The structure of cleaning equipment was designed based on cleaning process of microchannel plate, and the key parts of equipment were expounded. Liquid sprinkle and schlichting streaming were achieved with liquid spurt and subaqueous under-liquid jet reduced the system complexity. Different size etching products and pollutants were cleaned by ultrasonic and megasonic cleaning technology. The acoustic field uniformity was improved by cleaning tank incline design. Improved accuracy of power attained to ± 10%. Combined preheating liquid of storage tank and on-line heating liquid of cleaning tank, temperature accuracy attained to ± 0.5 ℃ for improving the stability and consistency of process parameters. The new system represents creativity and practicability of wet cleaning process for microchannel plate, the semi- automatic cleaning process was realized.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第3期208-211,共4页
Semiconductor Technology
基金
国家部委重点基金资助项目(4040505101B)
关键词
微通道板
湿法清洗
工艺模块
设备研制
MCP （microchannel plate）
wet cleaning
process module
equipment R＆D
