摘要
为了研究焊后残留物的腐蚀性以及可能对PCB的电气绝缘性能造成的影响,通过表面绝缘电阻(Rs)试验和电化学迁移试验评价了三种不同固体含量的无VOC(挥发性有机物)免清洗助焊剂焊后残留物的可靠性。结果表明,使用w(固体含量)为3.6%的助焊剂,湿热试验后试件的Rs大幅下降,并且PCB表面腐蚀严重;而w(固体含量)为2.3%的助焊剂,则试件具有较高的Rs(6.4×109Ω),并且对PCB腐蚀性小。使用放大30倍的显微镜观察电化学迁移测试后的试件,均没有发现枝晶。
In order to study the corrosion of fluxes residues and the effect of fluxes residues on electrical insulation resistance of PCB, three kinds of VOC-free water-based no-clean fluxes were investigated. Surface insulation resistance （R5） test and electrochemical migration （ECM） test were experimented to estimate the effect of fluxes residues on reliability of PCB Results show that Rs values relate to the solid contents of flux used in the test. When w（solid content） is 3.6% in the flux, R5 values of samples dropped extremely and severe corrosion occur on samples, whereas w（solid content） is 2.3%, R5 values of samples do not drop too much （6.4x10^9Ω） and little corrosion occur. Then these samples are observed under magnification of 30 times for detailed visual examination. No visible dendrite growth occur on these samples.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第3期68-71,共4页
Electronic Components And Materials
基金
"十一五"国家科技支撑重点资助项目(No.2006BAE03B02)
北京市教委"环境协调连接材料与加工技术"学术团队计划资助项目
北京市属市管高等学校人才强教计划资助项目
关键词
电子技术
免清洗助焊剂
无VOC
可靠性
表面绝缘电阻
电化学迁移
electron technology
no-clean flux
VOC-free
reliability
surface insulation resistance
electrochemicalmigration
