摘要
研究低温烧结型银/玻璃体系浆料的成分配比、制备工艺及其半导体芯片贴装烧结工艺,探讨浆料中银粉、玻璃粉和有机载体的成分对浆料烧结体的微观组织、热导率、线膨胀系数及芯片组装的剪切力之间的影响关系,利用理论模型计算浆料烧结体的热导率和线膨胀系数,分析其理论计算值与实测值差异的影响因素。结果表明:随着玻璃粉含量的增加,浆料烧结体的线膨胀系数及热导率逐渐降低,当银粉和玻璃粉的质量比为7:3,固体混合粉末与有机载体的质量比为8:2时,芯片贴装后可满足热导率和线膨胀系数性能的要求,同时所承受的剪切力最大。
The composition, preparation and sintering curve of a low-temperature sintered Ag/glass paste were studied. The effects of composition of paste on the microstructure, thermal conductivity, coefficient of thermal expansion （CTE） and shear force were studied. The theoretical models were employed to calculate the CTE and thermal conductivity of Ag/class. The influence factors on the coefficient of thermal expansion and thermal conductivity were analyzed. The results show that the CTE and thermal conductivity of composite decrease apparently with increasing glass content. When the ratio of silver to glass flits is 7：3 and the ratio of solid powder to organic vehicles is 8：2, the semiconductor chip assembly can satisfy the demand of CTE and thermal conductivity, and the optimal shear force can also be obtained.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2008年第3期476-482,共7页
The Chinese Journal of Nonferrous Metals
基金
国防科工委资助项目(JPPT-115-471)
关键词
低温烧结型银浆料
线膨胀系数
热导率
剪切力
low-temperature sintered Ag/glass paste
coefficient of thermal expansion
thermal conductivity
shear force
