摘要
论述了镀镍液中有机杂质净化方法有空载电解、活性炭处理、H2O2或KMno4等处理。探讨了有机杂质对镀液污染的机理。初步试验了几种添加剂，将它们的功能基团有机地结合起来，比较明显地起到消除有机杂质作用。
Such methods of removing organic impuirities from Ni plating bath as no-load electrolysis and treatment with activated carbon, H2O2 or KMnO4 are stated and mechanism of bath contamination by organic impurities is discussed. Some additives tentatively tested in laboratory, with their function-al groups organically combined, have quite clear effect in removing organic impurities.
出处
《电镀与环保》
CAS
CSCD
北大核心
1997年第1期8-10,共3页
Electroplating & Pollution Control
