摘要
使用调ＱＹＡＧ激光器对制作厚膜电路陶瓷基板的划片工艺进行了研究．通过对陶瓷的力学性质、划片机理和划片参数的理论推导，解决了该工艺的主要技术问题，实现了划线细、速度快、断面光滑和表面光洁的技术质量要求．
The technology of laser marking ceramics plate with thick film circuits is discussd.According to the theories of the mechanics of ceramics,and its marking and parameters,the main problems of the technology are solved,and the high speed,smooth section and glossy face are achieved.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
1997年第10期80-82,共3页
Journal of Shanghai Jiaotong University
关键词
激光加工
厚膜电路
陶瓷
划片工艺
laser processing
marking ceramics
thick film circuit
