摘要
COG邦定机是TET-LCD液晶模块生产线上的关键设备,主要用于IC片与显示屏的精确压接。在设计开发半自动COG邦定机的过程中,本文运用ANSYS软件模拟仿真邦定机压头在加热作用下的变化,研究关键部位的位移极值,仿真结果对设计有指导意义,可以节约设计成本。
COG Machine is key equipment on product line for TET-LCD, which is used for bonding IC and TET-LCD. During the process of designing COD bonding machine, this paper uses ANSYS to simulate and imitate the transformation of bonding machine's press part which is cause by heating, studies the displacement extremum of its key part. The result got by simulating is of instructional significance to design and can reduces the designing cost.
出处
《机电工程技术》
2008年第3期69-71,共3页
Mechanical & Electrical Engineering Technology
关键词
ANSYS
邦定机
高精度
有限元分析
ANSYS
bonding machine
high accuracy
finite element method
