摘要
分析了固溶处理、冷变形以及时效处理对Cu-Ni-Si系列合金的显微硬度、电导率的影响规律。同时通过设计3种不同成分(Cu-Ni-Si、Cu-Ni-Si-Ag、Cu-Ni-Si-P)的引线框架材料,分析了合金成分Ag、P对Cu-Ni-Si基引线框架材料性能的影响。结果表明,微量P能有效提高合金的显微硬度,稍微降低了铜基体的电导率;微量的Ag能提高合金的硬度,但作用没有P明显,而且Ag能提高铜基体的电导率。
Effects of solid solution,cold deformation and aging on micro-hardness and electrical conductivity of Cu-Ni-Si alloy were investigated. Meanwhile,effects of Ag and P on properties of Cu-Ni-Si alloy were examined. The results reveal that minor P content can effectively improve the microhardness of alloy with the slight decrease of electric conductivity. Minor Ag can increase both micro-hardness and electric conductivity of the alloy.
出处
《特种铸造及有色合金》
CAS
CSCD
北大核心
2008年第5期404-406,共3页
Special Casting & Nonferrous Alloys
基金
国家高技术研究发展计划(863计划)资助项目(2006AA03Z528)
国家自然科学基金资助项目(50571035)
河南省杰出青年基金资助项目(0521001200)
