摘要
反应体系中引入强还原剂水合肼,通过反应条件抑制置换反应,使银氨溶液优先发生液相还原反应,制备了与原铜粉粒径和形貌大致相同的铜-银双金属粉。敏化、活化处理过程中采用新的活化剂AgNO3取代传统的PdCl2,经济可行又避免引入新的杂质。采用XRD,SEM,EDX等检测方法对预处理后铜粉和包覆双金属粉的晶相组成及含量、铜-银双金属粉形貌、表面包覆层相组成及含量以及整个包覆过程的机理加以研究。研究表明:水合肼还原法经过3次包覆后,铜粉表面形成连续的银膜,克服了置换反应消耗过多的铜粉、制备的铜-银双金属粉呈胶状不易洗涤、干燥后易于结块等不足。
Cu-Ag bimetallic powder with the grain size similar to the copper powder has been prepared by reduction reaction using hydrazine as a reducing agent through inhibiting substitution reaction. It is a economical technique to use AgNO3 replacing the conventional PdCl2 and can solve the impurity of bath in the process of sensitization and activation treatment. The composition and content for the pretreated and coated copper powder, the morphology of Cu-Ag bimetallic powder, the composition of the coated-surface are characterized in turn by XRD, SEM and EDX, etc. The results show that a continuous silver film is formed on the surface of copper powder by coating for three-times. The problems, such as the consumption of copper powder itself, the colloid Cu-Ag bimetallic powder not to be washed easily and the agglomerate after drying, have been overcome.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2008年第5期905-908,共4页
Rare Metal Materials and Engineering
关键词
水合肼
超细铜粉
双金属粉
机理
hydrazine
ultra-fine copper powder
bimetallic powders
mechanism
