摘要
MEMS微型热敏传感器在流动测量领域有重要应用,而隔热结构对传感器性能有着决定性影响。综合六种常见的隔热结构,借助有限元计算研究对比了硅基底上不同隔热层材料、硅基底上有无隔热空腔结构、全聚合物柔性基底、全硅基底等对传感器灵敏度、热响应速度的影响情况,结合对热敏传感机理的分析进行了影响原因及其规律探讨。该研究可为微型热敏传感器的隔热结构设计及其性能优化提供参考依据。
Heat insulation is crucial to develop micromachined thermal sensors with high performance. By using FEA, typical heat insulation structures were studied, including the structure with different heat barrier layer beneath sensitive element, with or without cavity on silicon substrate, and using polymer as whole flexible substrate. Influence of heat insulation structures on sensor＇s sensitivity and response time was investigated,and the inherent mechanism was analysed. The research results are useful for design or optimization of micro thermal sensors.
出处
《传感技术学报》
CAS
CSCD
北大核心
2008年第6期933-937,共5页
Chinese Journal of Sensors and Actuators
基金
航空基金资助(04I53074)
国家自然科学基金资助(50775188
