摘要
热失效是影响半导体器件的性能和可靠性的主要原因,热特性和温度测量是整个电子系统热设计过程中的关键环节。光学测量方法具有非接触、无损伤的优势,在半导体及电子系统研究领域应用日益广泛。评述了各种半导体器件热特性光学测量技术的工作原理、实验装置、技术指标、应用现状,总结了现有方法中的关键问题和发展方向。
Thermal issues play an important part in optimizing the performance and reliability of electronic devices in electronic system.To improve the performance and reliability of microelectronic devices and also to validate thermal models,accurate knowledge of local temperatures and thermal properties is required.Optical techniques have been applied broadly in the research area of semiconductor and electronic system for their advantages of noncontactness and nondestructivity.This paper presents principles,setups,characteristics and applications of optical techniques that measure the temperatures of electronic devices or detect the thermal properties of materials. And improt problems and direction development are also summarized.
出处
《激光与光电子学进展》
CSCD
北大核心
2008年第6期51-58,共8页
Laser & Optoelectronics Progress
基金
国家自然科学基金重点项目(50737004/E0706)
关键词
半导体器件
热特性
光学测量技术
图像处理
semiconductor device
thermal property
optical measuring technique
image processing
