摘要
利用有限元分析方法研究在铜金属化晶片上进行金引线热超声键合的过程,建立基于率相关材料特性的热超声键合有限元模型,对键合中的碰撞和超声振动两个键合阶段进行了仿真.通过引入键合界面单元变形量、接触率等参量,得出劈刀运动历程对键合界面变形的影响规律,进而也揭示了其对键合强度的影响.
The thermosonic Au wire bonding on Cu/low-K wafers, which involves impact and ultrasonic stages, was modeled and simulated. The model is based on finite element method for the rate sensitive materials. Some variables, such as the plastic deformation in bond interface and the contact ratio, were de fined in this study. So the effects of the capillary motion on interfacial deformation and bond strength were described accurately.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2008年第5期716-719,共4页
Journal of Shanghai Jiaotong University
基金
国家自然科学基金重大项目(50390060)
关键词
热超声键合
率效应
界面变形
键合强度
thermo-sonie bonding
rate effect
interfaeial deformation
bond strength
