摘要
采用多坯料挤压法结合粒度配比、热压固相烧结法制备了3层W-Cu梯度功能材料，并对微观组织及性能进行了分析。结果表明：多坯料挤压法制备的3层坯体，层与层之间结合紧密，各层形状规整、厚度均匀；热压固相烧结后可得到近全致密的W-Cu梯度材料，层与层之间的界面位置清晰，组织结构致密，成分分布保持为最初的梯度设计结果，各层中Cu相形成了理想的网络结构，W颗粒镶嵌在网状结构中；封接层、中间层、散热层的相对密度分别达到98.3％、99.3％和99．9％，硬度分别为91.3、93．6和74．0HRB。在室温-100℃范围内，封接层的热膨胀系数为6.97×10^-6／℃，可实现与BeO基板材料良好的热匹配。
W-Cu functionally gradient materials have been fabricated by multi-billet extrusion （MBE） , particle size adjustment and solid-state hot press method, and the microstructure and properties have been analyzed. The results show that the bonding of three-layer billet is good, the shape is regular, and the thickness of each layer is uniform. The W-Cu functionally gradient materials with high density can be fabricated by the solid-state hot press method, and the layer boundary is distinct, the structure of each layer is dense, and the component of initial gradient design is kept stable. The Cu phase forms the network structure, and the W inserts in it. The relative density of the sealing layer, the transitional layer and the radiating layer is 98.3%, 99.3% and 99.9%, respectively, and the hardness is 91.3 HRB, 93.6 HRB and 74.0 HRB, respectively. In the range of room temperature （RT） to 100℃, the coefficient of thermal expansion （a） is 6.97×10^6/℃ for the sealing layer of W/Cu20, well matching with the BeO substrates.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2008年第7期1269-1272,共4页
Rare Metal Materials and Engineering
基金
国家杰出青年科学基金资助项目(50125415)
关键词
梯度功能材料
钨铜合金
多坯料挤压
相对密度
functionally gradient material （FGM）
W/Cu alloy
multi-billet extrusion （MBE）
relative density
