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室温固化耐高温胶粘剂的研究 被引量:6

Study on high temperature resistance adhesive for room temperature curing
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摘要 以环氧氯丙烷和对氨基苯酚为主要原料制备了多官能度的环氧树脂(EP-005),并采用自制的复配固化剂、纳米SiO2、特殊的增韧剂和特种填料等进行改性,制得了一种结构加固用的建筑耐温结构胶。实验结果表明,该胶粘剂可常温固化,加固后的构件可在常温与高温(150℃)环境中长期使用;该胶粘剂在150℃时的剪切强度为17.28 MPa,常温拉伸强度为42.60 MPa,常温压缩强度为90.63 MPa;该胶粘剂具有卓越的综合性能,并已成功用于建筑工程等领域中。 The polyfunctionality epoxy resin(EP-005) was prepared with epichlorohydrin and aminophenol as main materials. It was modified by a self-made compound curing agent, nano-SiO2, special toughener and filler and so on, a building structure adhesive of high temperature resistance was prepared for strengthening structure. The experimental results showed that this adhesive could cure at room temperature, after strengthening parts should being used for longer term from room temperature to 150 ℃. The shearing strength at 150 ℃ was 17.28 MPa, the tensile strength at room temperature was 42.60 MPa, the compression strength at room temperature was 90.63 MPa. This adhesive had excellence synthetical properties, and was used successfully in constructions engineering fields.
作者 黄巧玲
出处 《中国胶粘剂》 CAS 2008年第7期24-27,共4页 China Adhesives
基金 中建总公司重点科技开发项目<建筑结构加固与改造成套技术>子课题之一[CSCEC-2004-Z-01(4)]
关键词 纳米 改性 复配固化剂 耐高温 建筑结构胶 胶粘剂 常温固化 Nano modification compound curing agent high temperature resistance building structure adhesive adhesive room temperature curing
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  • 1夏萍,王巍屹,薄淑琴,杨国钧,陈天禄.碱金属碳酸盐催化合成酚酞环氧树脂[J].应用化学,1994,11(5):41-44. 被引量:4
  • 2张恩天,马麟,张淑芳,李奇力.室温固化环氧结构胶粘剂的现状及发展[J].化学与粘合,1996,18(4):221-223. 被引量:7
  • 3俞志亮.[D].太原:华北工学院分院,2003,20-30.
  • 4John S Horvath.Mathematical modeling of stress-strain-time behavior of geosynthetics using the Findley Equation[R].Manhattan College Research Report (CE/GE-98-3),1998.
  • 5樱井富美夫.日本接着学会志[Z],1997,(3):118-118.
  • 6A. Lapprand, C. Arribas, C. Salom, R. M. Masegosa and M. G. Prolongo.Epoxy resins modified with poly(vinyl acetate). Journal of Materials Processing Technology, 2003,143-144:827-831.
  • 7Sankar Prasad Bhuniya and Sukumar Maiti. Phosphorus based epoxy terminated structural adhesive 2. Curing, adhesive strength and thermal stability. European Polymer Journal, 2002,38( 1 ): 195-201.
  • 8C. Dispenza, F. Scr o, A. Valenza and G. Spadaro. High energy radiation cure of resin systems for structural adhesives and composite applications.Radiation Physics and Chemistry, 2002, 63(1): 69-73.
  • 9Weiping Liu, Suong V. Hoa and Martin Pugh. Organoclay-modified high performance epoxy nanocomposites, Composites Science and Technology,2005,65 (2):307-316.
  • 10HAN J L,CHERN Y C,LI K Y,et al. interpenetrating polymer network of bismaleimide and polyurethane-crosslinked epoxy[J]. J Appl Polym Sci,1998,70(3):529.

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