摘要
研制了MEMS特种压力传感器的组装系统.首先给出了MEMS特种压力传感器组装工艺过程,并通过分析得出组装精度下降将导致传感器灵敏度和线性性能下降的结论.在此基础上确定了自动组装系统的组成结构,并详细介绍了研制的具有力感知功能的微操作手、三工位键合炉以及显微视觉等关键技术模块.通过分析现有硅膜焊盘图形对称性分布的特点,给出了一种芯片中心求取方法,为高精度自动组装奠定了基础.最后,将各模块集成建立了自动组装系统,给出了各个模块的控制节拍和流程,并通过实验证明该系统可实现5,μm的组装精度和25,s/个的组装效率,适用于多种MEMS传感器的自动组装作业.
An automatic microassembly system for MEMS pressure sensor packaging was developed.In order to analyze the influences of assembly precision on the sensibility, linearity and other capabilities of sensor, the packaging process of MEMS pressure sensor was introduced in detail.The automatic assembly system consists of a micro force sensor integrated micromanipulator, a bonding centre with three working cells, and a microscopic vision module.Through analyzing the sym- metry characteristics of graph of welding points on the chip, a detection method was given for locating chip centre, which lays a foundation for automatic assembly with high precision.At last, the automatic assembly system was developed and the time distributing in a manufacturing cycle was provided.Experimental results prove that the system has 5 pa-nprecision and 25 s/chip efficiency, and can be used for many other packaging tasks.
出处
《纳米技术与精密工程》
EI
CAS
CSCD
2008年第4期297-301,共5页
Nanotechnology and Precision Engineering
基金
国家高技术研究发展计划(863)资助项目(2006AA04Z256)
