摘要
引线框架是集成电路中极为关键的部件之一,其主要功能是支撑芯片、散失工作热量和连接外部电路等。铜合金以其优良的性能成为重要的引线框架材料。本文综述了铜基引线框架的国内外研究现状,并重点介绍了在Cu-Ni-Si合金中加入微量合金元素P、Cr、Ag的微合金化研究成果。
The lead frame is one of the key parts in integrated circuit, which supports core wafer, dissipates heat and connects with outer parts. Copper alloys have become important materials for making lead frames, as its excellent properties. The current status of research on lead frame materials at home and abroad is reviewed, covering the improvement of Cu-Ni-Si alloy with elements P, Cr and Ag alloy elements P, Cr and Ag to Cu-Ni-Si alloy in our recent research is discussed in this paper.
出处
《材料开发与应用》
CAS
2008年第4期101-107,共7页
Development and Application of Materials
基金
国家863计划基金(2006AA03Z528)
国家自然科学基金(50571035)
河南省杰出青年基金(0521001200)
