摘要
针对微热板阵列建立了热路模型,并对热干扰进行分析.结果表明,由于微热板悬空结构的热阻比硅芯片的热阻高3个数量级,因此微热板阵列芯片的热干扰温度取决于封装对环境的热阻,而芯片上器件的间距对热干扰温度的影响可以忽略.研制了3种布局、TO5和DIP16两种封装形式的微热板阵列,并对阵列中的热干扰问题进行了实验测试.测试数据验证了热路模型的结论.因此,减小微热板阵列或集成芯片的热干扰的关键在于,尽可能增大微热板悬空结构的热阻以及选用热阻小的封装形式.
In the chips of integrated micro hotplate （MHP） arrays,thermal crosstalk affects the accuracy of MHP temperature con- trol. In silicon chips, thermal crosstalk effect is mainly dependant on the distance between the elements in the system and the thermal properties of the package. This paper constructs a thermal circuit for an MHP array and discusses the thermal crosstalk. The results show that the thermal resistance of the MHP structure is 3 magnitudes higher than the thermal resistance of the silicon substrate. Thus,the thermal crosstalk is not dependant on the distance between the MHPs but mainly depends on the thermal resistance of the package. Three MHP arrays with different layouts are fabricated and packaged in TO5 or DIP16. The experimental data support the results of the thermal circuit. Therefore, the key to reducing the thermal crosstalk of the integrated MHP systems is to use a low ther- mal resistance package and to enlarge the thermal resistance of the MHP structure as much as possible.
基金
国家高技术研究发展计划资助项目(批准号:2006AA040102
2006AA040106)~~
关键词
微热板阵列
热干扰
热路模型
封装
micro hotplate array
thermal crosstalk
thermal circuit
package
