摘要
分析了无铅焊膏的构成和技术要求。对无铅焊膏用焊粉及助焊剂配方设计的现状进行了讨论,焊粉的成分多为Sn、Ag和Cu,粒度越来越多地采用20μm;助焊剂多为改性松香、有机酸活化剂等。展望了无铅焊膏的研究与发展趋势。
Constituents and technical requirements of lead-free solder paste were analyzed. Current state of the formulation design of solder powder and fluxes used for lead-free solder paste was discussed. Ingredients of solder powder are Sn, Ag and Cu, generally, particle size of 20 μm is used more and more, ingredients of fluxes include modified rosin, organic acid activators etc. The prospect for the research and development tendency of lead-free solder paste was made.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第9期31-34,39,共5页
Electronic Components And Materials
基金
"十一五"国家科技支撑重点资助项目(2006BAE03B02)
北京市属市管高等学校人才强教计划资助项目
关键词
电子技术
无铅焊膏
综述
配方设计
electron technology
lead-free solder paste
review
formulation design
