摘要
通过不同升温速率下的DSC研究了环氧树脂/酸酐固化体系的固化动力学。利用DSC、DMA和TGA研究了固化体系的耐热性能。通过分析确定了体系的固化工艺,采用K issinger、Ozawa法计算出固化体系的表观活化能,其均值为62.00 kJ/mol,结合Crane公式求出反应级数为0.92。采用DSC法测得玻璃化转变温度Tg=183℃。采用DMA法测得玻璃化转变温度Tg=182℃。热失重曲线表明,固化体系的起始分解温度为350℃。
Curlng process, curing reaction kinetics parameters and thermal properties of epoxy resin cured with anhydride were investigated by DSC at different heating rates. And the heat resistance and the heat stability of the epoxy resin curing system were investigated by means of DMA and TGA respectively. The curing process of the curing system was determined. Apparent activation energy of the curing system was calculated using Kissinger and Ozawa formula and its average value is equal to 62.00 kJ/mol. Based on Crane formula, the reaction series is 0. 92. Glass transition temperature （Tg） measured by DSC is 183 ℃ ,while 182 ℃ is for the DMA. The TGA curve shows that the initial decomposition temperature of curing system is 350 ℃.
出处
《粘接》
CAS
2008年第9期12-15,共4页
Adhesion
关键词
环氧树脂
固化动力学
玻璃化转变温度
热分解温度
epoxy resin
reaction kinetics
glass transition temperature
thermal decomposition temperature
