摘要
选择了NH4Cl、ZnCl2、KF和K2ZrF6四种助镀剂,分别对铜进行热浸镀铝的试验,并对热浸镀后双金属结合界面的形貌、成分、金相组织以及相关机理进行研究。结果表明,选择浓度为1%～10%的KF水溶液作为助镀剂,且铝液温度为680～710℃,浸镀时间为2～10s时取得了良好的助镀效果。XRD分析结果表明镀层化合物主要的相为CuAl2(θ)相。
In the process of hot-dip aluminizing, four kinds of solution： NH4Cl, ZnCk. KF. K2ZrF6 were used respectively on the substrate of copper. The morphology, the component, microstructure of bonding interface, and the mechanism of the process were studied. The results show that the best flux is the solution of KF （ 1% --- 10 % ）, the optimal temperature of the bath is in the range of 680- 710℃, and the appropriate hot dipping time is 2- 10 seconds, XRD results show that the intermetallic compound（IMC） compound is.
出处
《铸造技术》
CAS
北大核心
2008年第9期1267-1270,共4页
Foundry Technology
关键词
铜铝复合
热浸镀
助镀剂
界面
Interfacial bonding between Copper and Aluminium
Hot-dip aluminizing
Flux
Interface
