摘要
本文论述了微波集成陶瓷基片上焊接SMD,SMC出现的问题,并给予分析。
:This paper expounds the appearance problems caused by soldering SMD,SMC on microwave integrated ceramic chip and proposes solution to these problems.
出处
《电讯技术》
EI
北大核心
1997年第6期21-24,共4页
Telecommunication Engineering