摘要
Chip-scale integration of optoelectronic devices such as lasers, waveguides, and modulators on silicon is prevailing as a promising approach to realize future ultrahigh speed optical interconnects. We review recent progress of the direct epitaxy and fabrication of quantum dot （QD） lasers and integrated guided-wave devices on silicon. This approach involves the development of molecular beam epitaxial growth of self- organized QD lasers directly on silicon substrates and their monolithic integration with amorphous silicon waveguides and quantum well electroabsorption modulators. Additionally, we report a preliminary study of long-wavelength （〉 1.3 μm） QD lasers grown on silicon and integrated crystalline silicon waveguides using membrane transfer technology.
Chip-scale integration of optoelectronic devices such as lasers, waveguides, and modulators on silicon is prevailing as a promising approach to realize future ultrahigh speed optical interconnects. We review recent progress of the direct epitaxy and fabrication of quantum dot （QD） lasers and integrated guided-wave devices on silicon. This approach involves the development of molecular beam epitaxial growth of self- organized QD lasers directly on silicon substrates and their monolithic integration with amorphous silicon waveguides and quantum well electroabsorption modulators. Additionally, we report a preliminary study of long-wavelength （〉 1.3 μm） QD lasers grown on silicon and integrated crystalline silicon waveguides using membrane transfer technology.
基金
the Defense Advanced Research Projects Agency of the United States under Grant No.W911NF-04-1-0429
