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超细镍粉/微米镍粉复合电磁屏蔽涂料的研究 被引量：21

Investigation on the electromagnetic shielding effectiveness of the composite paints filled with ultrafine and micro-size Ni particles
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摘要 在水溶液中制备了大量的直径约为0.5μm的超细镍粉,将其与微米镍粉以不同的比例进行复合作为导电填料制备电磁屏蔽涂料。结果表明当超细镍粉与微米镍粉的比例适当时(质量比=1∶1),得到的涂料在130MHz^1.5GHz频段内具有比纯微米镍粉涂料更好的电磁屏蔽性能(40~55dB)。 Large-scale of ultrafine Ni particles with diameter about 0. 5μm were successfully by a facile chemical reduction method in aqueous solution. Composites filled with different proportion of ultrafine and micro-size Ni particles were fabricated to evaluate the electromagnetic interference shielding effectiveness. The results showed that the shielding effectiveness of ultrafine and micro-size Ni composites at quality ratio of 1 ： 1 could be 40- 55dB at 130MHz-1.5GHz,which is better than that of the composites filled with pure micro-size Ni particles.
作者 田俊涛 龚春红 余来贵 吴志申 张治军
机构地区 河南大学特种功能材料教育部重点实验室
出处 《功能材料》 EI CAS CSCD 北大核心 2008年第10期1615-1617,共3页 Journal of Functional Materials
基金 河南大学校内基金资助项目(07YBZR005)
关键词 超细镍粉 微米镍粉 复合物 电磁屏蔽性能 ultrafine Ni particles micro-size Ni particles composites electromagnetic shielding effectiveness
分类号 TM27 [一般工业技术—材料科学与工程]
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参考文献17

  • 1何益艳,杜仕国.铜系复合涂料的制备及导电性能[J].化工新型材料,2004,32(6):49-51. 被引量：8
  • 2Akif K. [J]. Mater Res Bull, 1996,31(7) :845-860.
  • 3Huang J C. [J]. Advances in Polmer Technology, 1995, 14:137-150.
  • 4Huang J C. [J]. Adv Polym Technol, 1995,14 : 137.
  • 5Lin Y S, Chiu S S. [J]. Applied Polymer Science, 2004, 93 : 2045-2053.
  • 6Wu H L, Yang Y T,Kuan H C,et al. [J]. Polymer Science : Part B: Polymer Physics, 2006,44 : 1096-1105.
  • 7Duan Y P,Liu S H,Wang G Q,et al. [J]. Applied Polymer Science, 2006,102 : 1839-1843.
  • 8Huang C Y, Wu C C. [J]. European Polymer Journal, 2000,36 : 2729-2734.
  • 9Huang C Y, Mo W W. [J]. Applied Polymer Science, 2002,85 : 1661-1668.
  • 10Tzeng S S,Chang F Y. [J]. Materials Science and Engineering A, 2001,302 : 258-267.

二级参考文献22

  • 1刘列,张明雪,胡连成,于翘.吸波涂层材料技术的现状和发展[J].宇航材料工艺,1994,24(1):1-9. 被引量：53
  • 2[5]Gautam Sarkar, Mridha S, Tan Tin Chong. Flip chip interconnect using anisotropic conductive adhesive [J]. J Mater Process Technol, 1999, 89-90: 484-490.
  • 3[6]Chan Y C, Luk D Y. Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects flip-chip-on-flex packages assembly ii.different bonding pressure [J]. Microelectron Reliab, 2002, 42: 1195-1204.
  • 4[7]Kyuny-Wook Paik, Myung-Jin Yim. New anisotropic conductive adhesive for low cost and reliable flip chip on organic substrates applications [A]. International Symposium on Electronic Materials and Packaging [C]. 2000. 282-288.
  • 5[8]Dominique Wojciechowski, Jan Vanfletern, Elisabeth Reese. Electro- conductive adhesive for high density package and flip-chip interconnections [J]. Microelectron Reliab, 2000, 40: 1215-1226.
  • 6[9]Akira Nagai, Kenzo Takemura, Kazuhiro. Anisotropic conductive adhesive films for flip-chip interconnection onto organic substrates [R]. 1998 IEMT/IMCP Proceedings, 353-357.
  • 7[10]Briegel R, Ashauer M, Sandmaier H. Anisotropic conductive adhesive of microsensors applied in the instance of a low pressure sensor [J]. Sens Actuat, 2002, A97-98: 323-328.
  • 8[11]Chan Y C, Hung K C, Tang C W. Degradation mechanisms of the anisotropic conductive for flip chip on flex applications [A]. Proceedings of 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing [C]. 2000. 141-146.
  • 9[12]Chiu Y W, Chan Y C, Lui S M. Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects [J]. Microelectron Reliab, 2002, 42: 1945-1951.
  • 10[13]Johan Liu. ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges [J]. Soldering Surf Mount Technol, 2001, 13(3): 39-57.

共引文献49

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引证文献21

二级引证文献120

功能材料
2008年 第10期

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