摘要
集成电路塑封对产品质量要求很高。传统的塑封模中几百个型腔只有一个注射头,各型腔成型工艺的差异较大,相应产品的合格率大约为96%。分析了相关IC塑封成型工艺,设计制造了一套SOP系列通用的多料筒MGP塑封模,该模具有28个注射头,每个注射头塑封20个(SOP14/16)的产品,大大减小了各型腔之间成型工艺的差距,并且通过更换不同模盒能够通用于SOP系列8、14、16三种不同产品的封装生产。经过制造和生产调试达到了设计的要求,产品合格率提高到99.9%。
Demand of product QC for IC encapsulation is higher. Conventional IC encapsulation mould has only a single gate plunger and difference in molding process is obvious between each cavity. The products that up to grade only 96% around. IC encapsulation process was analyzed, one set of MGP encapsulation mould of universal for IC SOP series was designed. This mould has 28 gate plunger, 20 products （SOP14/16） made by one gate plunger, the differences in molding process between each cavity greatly were decreased. The mould can packing three different mouldings to produce the SOP series of 8/14/16 universal with exchange the mould boxes. It is reached the design aim by manufactured and tryout and the products up to grade 99.9%.
出处
《半导体技术》
CAS
CSCD
北大核心
2008年第11期965-967,975,共4页
Semiconductor Technology
