摘要
文中介绍的是一种逐层切除并同时精确测量物体内外部三维形状的光电检测技术，该技术主要应用于激光快速成型制造系统的道工程测量中。
In the paper, an optoelectronic measuring technique used for laser rapid prototyping sys terns in reverse engineering is presented. In this technique, the accurate measurement of the inside and outside shapes of the three dimensional object can be achieved by layer--by--layer cutting the object.
出处
《激光与红外》
CAS
CSCD
北大核心
1997年第4期226-227,共2页
Laser & Infrared
关键词
三维测量
层析法
逆工程
激光快速成型
激光
three-dimensional measurement, layer by-layer cutting, reverse engineering, laser rapid prototyping
