摘要
BGA焊接后常常会在焊点中形成很多的空洞,特别是对于BGA的无铅焊接,由于焊接温度高,氧化严重,以及焊料的特殊性能决定了BGA的无铅焊接更容易形成空洞。空洞的产生不仅影响焊点的导热、导电性能,也会影响焊点的强度,从而对BGA工作的长期可靠性产生影响。分析了空洞产生的机理,以及用真空再流焊接实现BGA无铅、无空洞焊接的原理和工艺过程。指出真空再流焊接工艺在解决BGA的无铅、无空洞化焊接问题上确实是一项行之有效的方法。
Voids are usually formed in the solder joints after the soldering of BGA. Because of higher soldering temperature,serious oxidation and the special characters of lead - free solder, voids are formed easily for the lead - free soldering of BGA. BGA voids in the solder joints not only influence the electrical and thermal function, but also influence the mechanical robustness. They also influence greatly the long life reliability of BGA. Analyze the mechanism of void formation, and introduces the void - free and lead - free soldering of BGA with vacuum reflow soldering technology. Vacuum reflow soldering technology is a valid technology for the void - free and lead - free soldering of BGA.
出处
《电子工艺技术》
2008年第6期324-327,共4页
Electronics Process Technology
关键词
BGA
无铅
无空洞
真空再流焊接
BGA
Lead - free
Void - free
Vacuum reflow solder
