摘要
对微机电系统(Micro electro mechanical systems,MEMS)组装与封装工艺的特点进行了总结分析,给出了MEMS组装与封装设备的研究现状。针对MEMS产业发展的特点,分析了面向MEMS组装与封装的微操作设备中的工艺参数优化数据库、快速精密定位、模块化作业工具、快速显微视觉、柔性装夹和自动化物流等关键技术。在此基础上,详细介绍了研制的MEMS传感器阳极化键合设备和引线键合设备的组成结构、工作原理,并给出了组装和封装试验结果。最后,指出了MEMS组装与封装技术及设备研制的发展趋势。
The characteristics of micro electro mechanical system （MEMS） assembling and packaging process are analyzed, and the development status of machining devices is given. According to the characteristics of MEMS industry development, the key techniques of MEMS assembling and packaging devices are described, including database of technological parameters, fast precision positioning, modular working tools, fast micro-vision, flexible clamping and automatic material handling techniques. The composition structure and working principle of an anodized bonding device for MEMS pressure sensor and a wire bonding device are introduced, and some experimental results are given. At last, the development trend of MEMS assembling and packaging techniques and devices are discussed.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2008年第11期13-19,共7页
Journal of Mechanical Engineering
基金
国家高技术研究发展计划(863计划.2006AA04Z256
2007AA04Z343)
长江学者和创新团队发展计划(IRT0423)资助项目。
关键词
微机电系统
组装
封装
微操作
Micro electro mechanical system （MEMS） Fabrication Packaging Micromanipulation devices
