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不同方法去除金属托槽粘结剂对牙釉质的影响

Effects of different composite removal methods on enamel surface after metal bracket debonding
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摘要 目的:观察不同去金属托槽粘结剂方法对牙釉质的影响,寻求理想的去除粘结剂方法。方法:选择离体正常第一前磨牙50颗,包埋固定在测量基座中,用万能工具显微镜初次测量,粘结托槽。去托槽后随机分为5组,每组10颗,分别用5种方法(A组:金刚砂车针;B组:不锈钢凸轮;C组:碳钨车针;D组:金刚砂车针+碳钨车针;E组:不锈钢凸轮+碳钨车针)去粘结,记录操作时间,用万能工具显微镜再次测量后计算釉质损失量,并在扫描电镜下观察。结果:5组的釉质损失量按A组、B组、D组、E组、C组递减,除C组和E组比较差异无统计学意义外(P>0.05),其余各组两两比较差异均有统计学意义(P均<0.05)。5组去粘结剂方法所需时间按A组、B组、D组、E组、C组依次递增,各组比较差异均有统计学意义(P均<0.01)。电镜观察去粘结剂后釉质表面,C组和E组最理想,B组和D组较差,A组最差。结论:应用不锈钢凸轮+碳钨车针是较为理想的去粘结剂方法。 Aim: To explore the effects of five composite removal methods on enamel surface after metal bracket debonding and find an ideal method of removing residual composite.Methods:A total of fifty extracted normal permanent premolar teeth were collected.After the teeth were embedded vertically in blocks of plaster,the first measurement was made by universal measuring microscope.All samples were bonded with metal brackets routinely.After the resin material being completely polymerizated,the brackets were removed.Fifty teeth were randomly divided into five groups with ten teeth in each group.Then residual composite were removed and the time needed for composite removal was recorded respectively.The measurement was made by universal measuring microscope again.All samples were examined in a scanning electron microscope.Results:Enamel loss decreased in the following order: group A,B,D,E,C.There was a significant difference between every two groups(P〈0.05),but no significant difference between group C and E.There was a significant difference for time taken between every two groups,which increased in the following order:group A,B,D,E,C.Under SEM the enamel surfaces were the best in group C and E,bad in group B and D,and worst in group A.Conclusion: Low-speed latch type finishing bur with komet slow speed tungsten carbide bur is an ideal method of removing residual composite.
作者 杨建浩
出处 《郑州大学学报(医学版)》 CAS 北大核心 2008年第6期1226-1228,共3页 Journal of Zhengzhou University(Medical Sciences)
关键词 牙釉质 去粘结 扫描电镜 万能工具显微镜 dental enamel debonding SEM universal measuring microscope
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参考文献6

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