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玻璃/陶瓷体系低温共烧陶瓷的研究进展 被引量：2

Development of Low Temperature Co-fired Glass/Ceramic Substrate
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摘要 低温共烧陶瓷(LTCC)是现代微电子封装中的重要组成部分,因其性能优良而得到了广泛应用。LTCC基板材料可以分为玻璃/陶瓷体系和微晶玻璃体系两大类。本文叙述了玻璃/陶瓷体系低温共烧陶瓷的材料组成、研究现状、存在问题以及未来的发展趋势。 Low temperature co-fired ceramics （LTCC） is the important composite of modern microeleetronic packaging. The perfect properties make it useful widely. The material can be divided into two kinds： glass/ceramic and glass ceramics. The paper is reviewed the composites and research progress of low temperature co-fired glass/ceramic substrate materials in details. The problems and trends of glass/ceramic substrate are also described.
作者 陈兴宇 张为军 堵永国 郑晓慧
机构地区 国防科技大学航天与材料工程学院
出处 《佛山陶瓷》 2008年第12期43-47,共5页 Foshan Ceramics
关键词 低温共烧陶瓷 基板 玻璃/陶瓷 low temperature co-fired ceramics （LTCC）, substrate, glass/ceramic
分类号 TQ174 [化学工程—陶瓷工业]
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参考文献22

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二级参考文献56

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共引文献57

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佛山陶瓷
2008年 第12期

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